Effect of deposition time and thermal emittance of copper sulphide thin films for use as a selective coating
Ighodalo J.E., Iyoha A., Enyi N.K.
Copper sulfide thin films were deposited on aluminum sample plates using simple and cost-effective electroless chemical bath deposition (ECBD) techniques at a fixed temperature of 303K and varying deposition time ranging from 16 to 36 hours. A thermocouple potentiometer was used to measure the thermal emittance of the coated sample plates. Our results show that the thermal emittance values range from 0.161 to 0.192, depending on the deposition time. Observed also is the film thickness, which varies from 3.00 to 6.00 μm. It was however, observed that the films deposited at low deposition time have low thermal emittance; hence films deposited at low deposition time can find applications in photothermal devicesPDF
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